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Inji Yeom

PartnerSeoul

Leads our Asian semiconductor, AI, and operations work in South Korea

Inji is a leader in McKinsey’s Asia Semiconductors Practice with deep expertise across the full semiconductor value chain—including memory IDMs, foundries, equipment, and materials companies. She advises global clients on strategic and operational topics ranging from technology roadmap planning to advanced packaging innovation and post-merger integration. Inji coleads the firm’s work in advanced packaging and is a coauthor of “Advanced chip packaging: How manufacturers can play to win.”

Her recent semiconductor work includes:

  • designing and leading long-term cost innovation programs focused on raw materials and equipment optimization for global foundries and memory IDMs
  • supporting NAND business strategy, advanced packaging growth planning, and new market entry for a leading memory player
  • advising on implications of AI and inference-driven hardware customization to guide investment timing in high-performance memory

In addition to her semiconductor focus, Inji is a core leader in the firm’s Product Development & Procurement Practice.

She has supported major clients across industries in large-scale transformation efforts, with a focus on capability building, digital enablement, and cost transparency.

Her recent procurement and product development work includes:

  • driving global R&D and procurement transformations by embedding digitally enabled tools into workflow systems
  • delivering capability-building programs on cleansheet cost modeling, best-cost sourcing, and negotiation strategy
  • advising on cross-functional operating model design to improve efficiency across product development, engineering, and procurement

Inji holds a PhD in material science from the University of Oxford, where her research focused on ternary semiconductor nanocrystal synthesis for optoelectronic devices. Additionally, she earned a BEng in materials science and engineering from Imperial College London.

PUBLISHED WORK

"The true AI transformation begins before the tech does," Chosun Ilbo, June 2025

Advanced chip packaging: How manufacturers can play to win,” McKinsey & Company, May 2023

EDUCATION

Oxford University
Post-PhD, materials science

Imperial College London
BEng, materials science engineering